Job Overview
MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications.
The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession.
Role and Responsibilities
Required Skills and Experience
Salary range: $180,000 - $250,000
Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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